Awards-Archiv · SEHO - Complete Solutions

SEHO Wins 2nd Place at the productronica Innovation Award 2025!

Heike Schlessmann — Mon, 01 Dec 2025 13:19:38 +0000

Thermographic monitoring of flux application sets new standards.

We couldn’t be more proud: Our technology for process-integrated, inline-capable monitoring of flux application, developed in collaboration with SIEMENS AG, Foundational Technologies Berlin, was awarded second place in the Future Markets Cluster at productronica 2025. This award is impressive confirmation of how relevant and forward-looking this development step is for electronics manufacturing.

A breakthrough for a process step that was previously impossible to monitor

The application of flux in wave and selective soldering is a key process step, but one that has been difficult to control until now. Too little flux leads to soldering errors such as incomplete penetration or cold solder joints, while too much can cause residues that can impair the function of the assembly.
Previous monitoring methods are generally based on random sampling or purely functional checks of the fluxer. They therefore do not provide any information about the actual application on the individual printed circuit board.

This is precisely where the new technology comes in: For the first time, it is possible to test every printed circuit board inline and automatically. Not only is the amount of flux applied monitored, but also its exact position.
The system utilizes the physical effect that heat is locally extracted from the assembly when the solvent in the flux evaporates. This makes wetted areas appear cooler.
A thermal imaging camera captures this pattern immediately after fluxing and evaluates it intelligently. The analysis is based on a reference model, either a thermographic image or a CAD-based digital twin.

The result is a reliable, highly accurate decision as to whether an assembly is correctly fluxed and approved for the soldering process.

More quality, more efficiency – and the path to autonomous manufacturing

The practical implications are enormous: Incorrect flux application is detected immediately rather than only becoming apparent after soldering, and the corresponding assemblies can be automatically removed from the production line.
This reduces waste, prevents unnecessary rework, and increases process reliability throughout the entire production flow.
At the same time, the technology forms the basis for future AI-supported optimization in real time. The thermographic data collected can be used in the future to automatically adjust process parameters and implement adaptive, self-regulating manufacturing.

As a result, the system not only closes a long-standing gap in process monitoring, but also opens up new possibilities for quality, efficiency, and automation, especially in areas with high requirements.

An award that stands for a strong team

This award is a special achievement for us at SEHO, as it demonstrates what can be achieved when expertise in manufacturing technology, software development, and research come together.
We would like to thank everyone involved for driving this project forward with passion and an innovative spirit, and of course we would like to thank the jury of the productronica Innovation Award for this outstanding recognition.

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SEHO receives the Global Technology Award 2021

Fabio Thoma — Wed, 17 Nov 2021 11:34:30 +0000

SEHO was awarded a GLOBAL Technology Award in the category of Selective Soldering for its new SmartSplit.

SEHO SmartSplit is an intelligent software that controls and coordinates the process sequence for different assemblies in mixed operation. This newly developed software component turns an efficient system for batch production into an innovative selective soldering system for high-mix-high-volume production, without retrofitting and without additional costs.

SmartSplit automatically distributes the various process tasks, such as flux deposition, soldering process with up to six soldering units and selective brushing process, to the available process stations that are integrated in the individual machine. As a result, SEHO SmartSplit allows high mix – high volume production in selective soldering processes by cutting the cycle times in half. This amazing new function can be integrated in the SelectLine-C machine platform as well as the new LeanSelect-plus.

The space-saving conception of the individual process stations minimizes floor space costs. In addition, several soldering units in a system can use one service station centrally. A further advantage of the SmartSplit software is its programming simplicity. Only the overall soldering task has to be programmed for an assembly.

The GLOBAL Technology Awards have recognized the very best new innovations in the printed circuit assembly and packaging industries since 2005. The prestigious awards contest has been bringing together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net/awards.

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SEHO receives the Global Technology Award 2017

Fabio Thoma — Wed, 22 Nov 2017 11:46:44 +0000

SEHO Systems GmbH is pleased to announce that it was awarded a 2017 Global Technology Award in the category of Soldering – Selective for its Integrated Additional Processes in Selective Soldering Systems. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. The SEHO PowerSelective and SEHO SelectLine selective soldering systems can be equipped with an automated selective brush system and an AOI system for immediate automatic cleaning and inspection of solder joints directly after the soldering process. All processes are integrated in ONE machine.

The ability to reduce production costs while maintaining consistently high quality is essential for electronic production. Solder balls represent a soldering defect that is considered particularly critical. There are numerous reasons for the formation of solder balls in selective soldering processes, ranging from poor process setup, up to the material used, such as the solder resist of the PCB. Solder balls can cause shorts leading to complete failure of the assembled product. Other typical soldering defects such as solder bridges, insufficient wetting or open solder joints also can severely affect the product quality and reliability.
Considering that manual cleaning or repair processes after soldering are not only expensive and time-consuming but also provide poor reproducibility, the target, therefore, is an automated and fully controlled zero-fault process.

With SEHO’s Integrated Additional Processes in Selective Soldering Systems, all processes – selective fluxing, preheating, soldering with selective mini-wave, multi-nozzle or even conventional wave soldering, selective brushing, AOI and cooling – can be performed in parallel for different boards. Therefore, the additional processes do not influence the cycle time. The advantages of the additional functions are obvious: Safe and reliable processes on the one hand, and reduced overall production costs on the other hand, as the integrated additional processes use the handling units of the soldering machines (conveyors, axes, grippers etc.) and in addition they do not require extra floor space.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

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